Michael J. Bohlinger
9Patents
7h-index
9Co-inventors
52Inventor score
Filing activity: Jun 6, 1997 → Jul 14, 2009
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7095226B2 | Vertical die chip-on-board | Emerging Cross-Sectional Technologies | 38 | Expired |
| US6504366B2 | Magnetometer package | Electricity | 34 | Expired |
| US6529114B1 | Magnetic field sensing device | Physics | 29 | Expired |
| US7671478B2 | Low height vertical sensor packaging | Electricity | 23 | Active |
| US5820924A | Method of fabricating a magnetoresistive sensor | Physics | 21 | Expired |
| US7271586B2 | Single package design for 3-axis magnetic sensor | Electricity | 11 | Expired |
| US7034651B2 | Magnetic field sensing device | Physics | 8 | Expired |
| US8703543B2 | Vertical sensor assembly method | Electricity | 3 | Active |
| US7202771B2 | Magnetic field sensing device | Physics | 3 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.