Ball limiting metallurgy, interconnection structure including the same, and method of forming an interconnection structure
US7273803B2 · kind B2 · utility
11Cited by
1References
14Claims
0Family size
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Key dates
| Filing date | Dec 1, 2003 |
| Grant date | Sep 25, 2007 |
| Priority date | — |
| Expiry date | May 23, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31681
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A ball-limiting metallurgy includes a substrate, a barrier layer formed over the substrate, an adhesion layer formed over the barrier layer, a first solderable layer formed over the adhesion layer, a diffusion barrier layer formed over the adhesion layer, and a second solderable layer formed over the diffusion barrier layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.