Stephen Kilpatrick
9Patents
4h-index
23Co-inventors
53Inventor score
Filing activity: Mar 6, 2003 → May 15, 2012
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6893799B2 | Dual-solder flip-chip solder bump | Electricity | 14 | Expired |
| US7273803B2 | Ball limiting metallurgy, interconnection structure including the same, and method of forming an interconnection structure | Emerging Cross-Sectional Technologies | 11 | Expired |
| US7410833B2 | Interconnections for flip-chip using lead-free solders and having reaction barrier layers | Electricity | 6 | Expired |
| US9252704B2 | Voltage tunable oscillator using bilayer graphene and a lead zirconate titanate capacitor | Electricity | 6 | Active |
| US8026613B2 | Interconnections for flip-chip using lead-free solders and having reaction barrier layers | Electricity | 3 | Active |
| US7037559B2 | Immersion plating and plated structures | Emerging Cross-Sectional Technologies | 1 | Expired |
| US7923849B2 | Interconnections for flip-chip using lead-free solders and having reaction barrier layers | Electricity | 1 | Active |
| US7276296B2 | Immersion plating and plated structures | Emerging Cross-Sectional Technologies | 0 | Expired |
| US6900142B2 | Inhibition of tin oxide formation in lead free interconnect formation | Electricity | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.