Redistribution layer with microstrips
US7273805B2 · kind B2 · utility
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1References
10Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 25, 2005 |
| Grant date | Sep 25, 2007 |
| Priority date | — |
| Expiry date | Jul 28, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30105
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes a completed semiconductor chip and a dielectric layer overlying the completed semiconductor chip. A redistribution layer overlies the completed semiconductor chip and is embedded in the dielectric layer. The redistribution layer includes a plurality of microstrip conductors. Each microstrip conductor has a height and a width selected such that the height is at least twice the width. In addition, each microstrip conductor is separated from an adjacent microstrip conductor by a spacing distance that is at least twice the width.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.