Resin composition, prepreg, laminate sheet and printed wiring board using the same and method for production thereof
US7273900B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 8, 2004 |
| Grant date | Sep 25, 2007 |
| Priority date | — |
| Expiry date | Sep 8, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31645
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
There are provided a resin composition comprising a crosslinking component with a weight average molecular weight of 1,000 or less having a plurality of styrene groups and represented by the following formula:wherein R is a hydrocarbon skeleton, each of R1s is a hydrogen atom or a hydrocarbon group, each of R2, R3 and R4 is a hydrogen atom or an alkyl group, m is an integer of 1 to 4, and n is an integer of 2 or more, at least one high-molecular weight compound, an inorganic filler, and at least one treating agent for said inorganic filler; its cured product; and a prepreg, a laminate sheet having a conductor layer, and a multilayer printed wiring board obtained by processing the conductor layer of the laminate sheet into wiring.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.