Thermal conductive electronics substrate and assembly
US7274105B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 28, 2005 |
| Grant date | Sep 25, 2007 |
| Priority date | — |
| Expiry date | Nov 28, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09836
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electronics assembly is provided including a circuit board substrate having a top surface and a bottom surface and a plurality of thermal conductive vias extending from the top surface to the bottom surface. At least one electronics package is mounted to the top surface of the substrate. A heat sink device is in thermal communication with the bottom surface of the substrate. Thermal conductive vias are in thermal communication to pass thermal energy from the at least one electronics package to the heat sink. At least some of the thermal conductive vias are formed extending from the top surface to the bottom surface of the substrate at an angle.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.