M. Ray Fairchild
7Patents
3h-index
18Co-inventors
50Inventor score
Filing activity: Apr 8, 2003 → Oct 29, 2013
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7215547B2 | Integrated cooling system for electronic devices | Electricity | 47 | Expired |
| US7274105B2 | Thermal conductive electronics substrate and assembly | Electricity | 11 | Expired |
| US7042331B2 | Fabrication of thick film electrical components | Emerging Cross-Sectional Technologies | 3 | Expired |
| US9230739B2 | PLZT capacitor on glass substrate | Electricity | 2 | Active |
| US6903561B2 | Circuitry for measuring mechanical stress impressed on a printed circuit board | Electricity | 1 | Expired |
| US7439083B2 | Technique for compensating for substrate shrinkage during manufacture of an electronic assembly | Electricity | 0 | Active |
| US7205652B2 | Electronic assembly including multiple substrates | Electricity | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.