Heatsink
US7274571B2 · kind B2 · utility
5Cited by
9References
15Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 8, 2005 |
| Grant date | Sep 25, 2007 |
| Priority date | — |
| Expiry date | Nov 7, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/1461
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method according to one embodiment may include providing a heatsink having a base having a first region with a thickness greater than a second region. The heatsink may further include a plurality of fins extending from the base with at least one fin oriented at an angle to at least another fin. The method of this embodiment may also include thermally coupling the heatsink to the heat generating component. Of course, many alternatives, variations, and modifications are possible without departing from this embodiment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.