Supporting plate
US7274572B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 26, 2005 |
| Grant date | Sep 25, 2007 |
| Priority date | — |
| Expiry date | Oct 31, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20154
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A supporting plate includes a metal plate and is utilized to support a heat sink module in an electronic device. The heat sink module has a thermal pad, and the electronic device has a first heat generating element and a second heat generating element. In addition, the heat sink module is contacted to the first heat generating element for conducting heat generated by the first heat generating element to the thermal pad. Moreover, the metal plate has a first concave portion and a second concave portion. The first concave portion is contacted to the thermal pad, and the second concave portion is contacted to the second heat generating element for conducting heat generated by the second heat generating element to the heat sink.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.