Large area flat image sensor assembly
US7276394B2 · kind B2 · utility
4Cited by
42References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 20, 2004 |
| Grant date | Oct 2, 2007 |
| Priority date | — |
| Expiry date | Apr 23, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
Abstract
A low temperature method for producing a substantially flat large area image sensor assembly, the method includes the steps of providing a die attach substrate having a substantially planar surface; providing a lead frame having a bonding surface and a plurality of leads extending there from; adhering an imager die to the substantially planar surface of the die attach substrate with a low curing temperature first adhesive; and adhering the die attach substrate with adhered imager die to a bonding surface of the lead frame with a low curing temperature second adhesive for producing an image sensor assembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.