Semiconductor device, circuit substrate, electro-optic device and electronic appliance
US7276792B2 · kind B2 · utility
3Cited by
3References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 13, 2005 |
| Grant date | Oct 2, 2007 |
| Priority date | — |
| Expiry date | Oct 2, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/01079
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device in the first embodiment includes: an electrode pad and a resin projection, formed on an active surface; a conductive film deposited from a surface of the electrode pad to a surface of the resin projection; a resin bump formed with the resin projection and with the conductive film. The semiconductor device is conductively connected to the opposing substrate through the resin bump electrode. The testing electrode is formed with the conductive film that is extended and applied to the opposite side of the electrode pad across the resin projection.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.