Heat dissipation device having wire fixture
US7277281B1 · kind B1 · utility
12Cited by
9References
12Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | May 12, 2006 |
| Grant date | Oct 2, 2007 |
| Priority date | — |
| Expiry date | May 12, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat dissipation device is for use in a computer enclosure, the computer enclosure having a group of wires (20) therein. The heat dissipation device includes a heat sink assembly. A wire fixture (60) is mounted on the heat sink assembly and configured for fixing the wires thereto. The wire fixture includes a mounting plate (62) positioned on the heat sink assembly. A bridge (624) projects from the mounting plate to form a receiving room (625) below the bridge. The wires are securely bound together via the wire fixture so as not to be loosened by vibration.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.