Method of forming light emitting devices with improved light extraction efficiency

US7279345B2 · kind B2 · utility

Assignee

• Philips Lumileds Lighting Company LLC · US

Inventors

• Michael D. Camras · San Jose, US
• Michael R. Krames · Los Altos, US
• Wayne L. Snyder · Palo Alto, US
• Frank M. Steranka · San Jose, US
• Robert C. Taber · Palo Alto, US
• John Uebbing · Palo Alto, US
• Douglas W. Pocius · Fremont, US
• Troy Trottier · San Jose, US
• Christopher H. Lowery · Chester, US
• Gerd O. Mueller · San Jose, US
• Regina B. Mueller-Mach · San Jose, US
• Gloria Hofler · Sunnyvale, US

Key dates

• Filing date: Sep 10, 2004
• Grant date: Oct 9, 2007
• Expiry date: Nov 17, 2024

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10H20/819

Abstract

A method of bonding a transparent optical element to a light emitting device having a stack of layers including semiconductor layers comprising an active region is provided. The method includes elevating a temperature of the optical element and the stack and applying a pressure to press the optical element and the stack together. In one embodiment, the method also includes disposing a layer of a transparent bonding material between the stack and the optical element. The bonding method can be applied to a premade optical element or to a block of optical element material which is later formed or shaped into an optical element such as a lens or an optical concentrator.