Method for packaging a light emitting device by one dispense then cure step followed by another
US7279346B2 · kind B2 · utility
53Cited by
27References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 27, 2005 |
| Grant date | Oct 9, 2007 |
| Priority date | — |
| Expiry date | Mar 10, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/856
Abstract
Methods of packaging a semiconductor light emitting device positioned in a reflective cavity are provided. A first quantity of encapsulant material is dispensed into the reflective cavity including the light emitting device therein and the first quantity of encapsulant in the reflective cavity is cured. A second quantity of encapsulant material is dispensed onto the cured first quantity of encapsulant material. A lens is positioned in the reflective cavity on the dispensed second quantity of encapsulant material. The dispensed second quantity of encapsulant material is cured to attach the lens in the reflective cavity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.