Integrated inductors and compliant interconnects for semiconductor packaging
US7279391B2 · kind B2 · utility
3Cited by
7References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 14, 2005 |
| Grant date | Oct 9, 2007 |
| Priority date | — |
| Expiry date | Nov 15, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03J2200/10
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Some embodiments of the present invention include integrated inductors and compliant interconnects for semiconductor packaging.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.