Inventor · Chandler, AZ, US

Sriram Muthukumar

32Patents
7h-index
43Co-inventors
69Inventor score

Filing activity: May 30, 2002 → May 25, 2023

Most-cited inventions

PatentTitleAreaCited byStatus
US7750487B2 Metal-metal bonding of compliant interconnect Electricity 35 Expired
US7851269B2 Method of stiffening coreless package substrate Electricity 12 Active
US7443030B2 Thin silicon based substrate Electricity 12 Active
US8143110B2 Methods and apparatuses to stiffen integrated circuit package Electricity 10 Active
US7378742B2 Compliant interconnects for semiconductors and micromachines Electricity 10 Expired
US7882628B2 Multi-chip packaging using an interposer such as a silicon based interposer with through-silicon-vias Emerging Cross-Sectional Technologies 10 Active
US6846731B2 Schottky diode with silver layer contacting the ZnO and MgxZn1-xO films Emerging Cross-Sectional Technologies 9 Expired
US7841080B2 Multi-chip packaging using an interposer with through-vias Emerging Cross-Sectional Technologies 6 Active
US7400041B2 Compliant multi-composition interconnects Electricity 6 Expired
US7049208B2 Method of manufacturing of thin based substrate Electricity 6 Expired
US10186480B2 Stacked-chip packages in package-on-package apparatus, methods of assembling same, and systems containing same Electricity 5 Active
US6979489B2 Zinc oxide nanotip and fabricating method thereof Emerging Cross-Sectional Technologies 5 Expired
US7589424B2 Thin silicon based substrate Electricity 4 Active
US7800402B1 Look-up table overdrive circuits Electricity 4 Active
US7279391B2 Integrated inductors and compliant interconnects for semiconductor packaging Electricity 3 Expired
US10006882B2 Biosensing system and methods using electron-ionic mechanisms at fluid-sensor interfaces Human Necessities 3 Active
US10134689B1 Warpage compensation metal for wafer level packaging technology Electricity 3 Active
US8502400B2 Methods and apparatuses to stiffen integrated circuit package Electricity 2 Active
US7400030B2 Schottky diode with silver layer contacting the ZnO and MgxZn1−xO films Emerging Cross-Sectional Technologies 2 Expired
US8387240B2 Methods for making multi-chip packaging using an interposer Emerging Cross-Sectional Technologies 1 Active
US11217516B2 Stacked-chip packages in package-on-package apparatus, methods of assembling same, and systems containing same Electricity 1 Active
US8860205B2 Method of stiffening coreless package substrate Electricity 1 Active
US7294525B2 High performance integrated inductor Electricity 0 Expired
US9349698B2 Integrated WLUF and SOD process Electricity 0 Active
US12076143B2 Wearable biosensors with room temperature ionic liquid buffer Human Necessities 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.