Polishing method
US7279425B2 · kind B2 · utility
1Cited by
25References
27Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 17, 2006 |
| Grant date | Oct 9, 2007 |
| Priority date | — |
| Expiry date | Oct 17, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/7684
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A polishing technique wherein scratches, peeling, dishing and erosion are suppressed, a complex cleaning process and slurry supply/processing equipment are not required, and the cost of consumable items such as slurries and polishing pads is reduced. A metal film formed on an insulating film comprising a groove is polished with a polishing solution containing an oxidizer and a substance which renders oxides water-soluble, but not containing a polishing abrasive.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.