Printed circuit board having embedded capacitors using hybrid material and method of manufacturing the same
US7281321B2 · kind B2 · utility
12Cited by
12References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 22, 2006 |
| Grant date | Oct 16, 2007 |
| Priority date | — |
| Expiry date | Feb 22, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4913
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention is related to a printed circuit board having embedded capacitors using a hybrid material and a method of manufacturing the same. This invention provides a printed circuit board having embedded capacitors using a material for a hybrid dielectric layer including liquid crystal polymer and ceramic powder, and a method of manufacturing such a printed circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.