Inventor · Seoul, KR

Jun Rok Oh

13Patents
5h-index
21Co-inventors
62Inventor score

Filing activity: Jan 6, 2005 → Mar 24, 2020

Most-cited inventions

PatentTitleAreaCited byStatus
US7186919B2 Printed circuit board including embedded capacitors and method of manufacturing the same Emerging Cross-Sectional Technologies 19 Expired
US7618553B2 Insulating material for printed circuit board Emerging Cross-Sectional Technologies 18 Active
US7281321B2 Printed circuit board having embedded capacitors using hybrid material and method of manufacturing the same Emerging Cross-Sectional Technologies 12 Expired
US8101248B2 Composition for forming substrate, and prepreg and substrate using the same Emerging Cross-Sectional Technologies 6 Active
US8043876B2 Light emitting diode package and manufacturing method thereof Electricity 5 Active
US8105663B2 Composition for forming substrate, and prepreg and substrate using the same Emerging Cross-Sectional Technologies 4 Active
US8053673B2 Capacitor embedded printed circuit board Electricity 3 Active
US7913368B2 Method of manufacturing chip capacitor including ceramic/polymer composite Emerging Cross-Sectional Technologies 2 Active
US7676921B2 Method of manufacturing printed circuit board including embedded capacitors Emerging Cross-Sectional Technologies 1 Active
US11040516B2 Graphite sheet and method for manufacturing same Chemistry; Metallurgy 0 Active
US11541634B2 Graphite sheet and method for manufacturing same Chemistry; Metallurgy 0 Active
US10968390B2 Composition for semiconductor process and semiconductor process Chemistry; Metallurgy 0 Active
US8829155B2 Poly(p-xylylene)-based polymer having low dielectric constant and low-loss property and insulating material, printed circuit board and functional element using the same Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.