Method of processing a workpiece
US7282158B2 · kind B2 · utility
2Cited by
19References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 24, 2005 |
| Grant date | Oct 16, 2007 |
| Priority date | — |
| Expiry date | Mar 24, 2025 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C16/56
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
This invention relates to a method of processing a workpiece in a chamber. Initially a surface of the workpiece is treated by a process which includes supplying a reactive gas to the chamber through a first gas supply and the surface is then further treated using a process gas supplied to the chamber through a second gas supply during the supply of the process gas so that a portion of the process gas flows into the first gas supply from the chamber to mitigate against residual reactive gas entering the chamber during the further treatment step.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.