Printed circuit board including embedded chips and method of fabricating the same using plating
US7282394B2 · kind B2 · utility
100Cited by
3References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 11, 2005 |
| Grant date | Oct 16, 2007 |
| Priority date | — |
| Expiry date | Jul 11, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of fabricating a printed circuit board (PCB) including embedded chips, composed of forming a hollow portion for chip insertion through a substrate, inserting the chip into the hollow portion, fixing the chip to the substrate by use of a plating process to form a central layer having an embedded chip, and then laminating a non-cured resin layer and a circuit layer having a circuit pattern on the central layer. Also, a PCB including embedded chips fabricated using the above method is provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.