Chang-Sup Ryu
43Patents
8h-index
62Co-inventors
74Inventor score
Filing activity: Nov 12, 2003 → Feb 4, 2014
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7282394B2 | Printed circuit board including embedded chips and method of fabricating the same using plating | Emerging Cross-Sectional Technologies | 100 | Expired |
| US7564116B2 | Printed circuit board with embedded capacitors therein and manufacturing process thereof | Emerging Cross-Sectional Technologies | 32 | Active |
| US7350296B2 | Method of fabricating a printed circuit board including an embedded passive component | Emerging Cross-Sectional Technologies | 21 | Expired |
| US7277005B2 | Printed circuit board including embedded resistor and method of fabricating the same | Electricity | 21 | Expired |
| US7351915B2 | Printed circuit board including embedded capacitor having high dielectric constant and method of fabricating same | Emerging Cross-Sectional Technologies | 14 | Expired |
| US7605459B2 | Coreless substrate and manufacturing thereof | Electricity | 13 | Active |
| US7707715B2 | Method of fabricating multilayer printed circuit board | Emerging Cross-Sectional Technologies | 9 | Active |
| US7583512B2 | Printed circuit board including embedded passive component | Emerging Cross-Sectional Technologies | 8 | Active |
| US7485569B2 | Printed circuit board including embedded chips and method of fabricating the same | Electricity | 6 | Active |
| US7378326B2 | Printed circuit board with embedded capacitors therein and manufacturing process thereof | Emerging Cross-Sectional Technologies | 5 | Expired |
| US9040838B2 | Method for forming solder resist and substrate for package | Electricity | 5 | Active |
| US7550316B2 | Board on chip package and manufacturing method thereof | Electricity | 4 | Active |
| US8432706B2 | Printed circuit board and electro application | Electricity | 4 | Active |
| US8981549B2 | Multi chip package | Electricity | 3 | Active |
| US8022553B2 | Mounting substrate and manufacturing method thereof | Electricity | 2 | Active |
| US7394249B2 | Printed circuit board with weak magnetic field sensor | Electricity | 2 | Expired |
| US8198550B2 | Printed circuit board and method of manufacturing the same | Emerging Cross-Sectional Technologies | 1 | Active |
| US7348772B2 | Printed circuit board having weak magnetic field sensor and method of manufacturing the same | Electricity | 1 | Expired |
| US8181339B2 | Method of manufacturing a printed circuit board | Emerging Cross-Sectional Technologies | 1 | Active |
| US8780584B2 | Printed circuit board and electro application | Electricity | 1 | Active |
| US7506437B2 | Printed circuit board having chip package mounted thereon and method of fabricating same | Emerging Cross-Sectional Technologies | 1 | Expired |
| US7622329B2 | Method for fabricating core substrate using paste bumps | Electricity | 1 | Active |
| US8232478B2 | Electromagnetic interference noise reduction board using electromagnetic bandgap structure | Electricity | 1 | Active |
| US8377748B2 | Method of manufacturing cooling fin and package substrate with cooling fin | Emerging Cross-Sectional Technologies | 1 | Active |
| US8966746B2 | Method of fabricating cavity capacitor embedded in printed circuit board | Emerging Cross-Sectional Technologies | 1 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.