Semiconductor device
US7282751B2 · kind B2 · utility
21Cited by
8References
6Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 28, 2004 |
| Grant date | Oct 16, 2007 |
| Priority date | — |
| Expiry date | Jul 28, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A portion-to-be-melted of a fuse is surrounded by plates, so that heat to be generated in a meltdown portion of the fuse under current supply can be confined or accumulated in the vicinity of the meltdown portion of the fuse. This makes it possible to facilitate meltdown of the fuse. The meltdown portion of the fuse in a folded form, rather than in a single here a fuse composed of a straight-line form, is more successful in readily concentrating the heat generated in the fuse under current supply into the meltdown portion, and in further facilitating the meltdown of the fuse.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.