Thermal interface with a patterned structure
US7282799B2 · kind B2 · utility
6Cited by
1References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 19, 2006 |
| Grant date | Oct 16, 2007 |
| Priority date | — |
| Expiry date | May 19, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/01057
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An interface is formed by pressing a patterned first surface and a second surface together, with a particle-loaded interface material in between. The first surface is fabricated with a pattern of channels designed to redistribute the velocity gradients that occur in the interface material during interface formation in order to control the arrangement, orientation and concentration of particles at the end of the interface formation. The concept finds application in thermal interfaces and controlled placement of nano and micro particles and biological molecules.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.