Circuit element having a first layer of an electrically insulating substrate material and method for manufacturing a circuit element

US7283372B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Werner Weber · Munich, DE
• Günter Schmid · Hemhofen, DE
• Richard Luyken · Munich, DE
• Roland Thewes · Puchheim, DE
• Markus Seitz · Birkenfeld, DE

Key dates

• Filing date: May 28, 2004
• Grant date: Oct 16, 2007
• Expiry date: Apr 11, 2026

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10K85/649
• WIPO field: Computer technology
• WIPO sector: Electrical engineering

Abstract

Circuit element having a first layer composed of an electrically insulating substrate material, a first electrically conductive material which is in the form of at least one discrete area, such that it is embedded in or applied to the substrate material, a second layer having a second electrically conductive material, and a monomolecular layer, which is composed of electrically active molecules which transports charge carriers, arranged between the first layer and the second layer. The monomolecular layer is immobilized and makes electrical contact with the second layer. Each of the electrically active molecules has a first unit, which is used as an electron donor, a second unit, which is used as an electron acceptor, wherein the electron donor and the electron acceptor form a diode, and at least one redox-active unit, by means of which a variable resistance is formed, arranged between the first unit and the second unit.