Modeling module
US7283921B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 10, 2005 |
| Grant date | Oct 16, 2007 |
| Priority date | — |
| Expiry date | Aug 10, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04Q1/20
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A modeling module is disclosed that couples to a modular platform chassis. The modeling module includes a resident management controller to implement a test to model a component layout for a module to be received and coupled to the modular platform chassis. The test includes an operating thermal load for a component resident on the module at a given location. The module has a dimensional length and width that is similar to that of the modeling module. The modeling module also includes a thermal load device that is responsive to the management controller. The thermal load device is to implement at least a portion of the test by simulating the operating thermal load for the component resident on the module at the given location.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.