Apparatus for mounting semiconductor chips
US7284318B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Dec 5, 2002 |
| Grant date | Oct 23, 2007 |
| Priority date | — |
| Expiry date | Sep 14, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53191
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus for mounting semiconductor chips has a pick and place system arranged stationary in vertical direction for the picking, transport and placement of a semiconductor chip onto a substrate. The pick and place system comprises a bondhead with a chip gripper deflectable relative to the bondhead. The deflection of the chip gripper takes place by means of a pneumatic drive arranged on the bondhead which has two pressure chambers separated by a piston, whereby the chip gripper is secured to the piston. The pressure p1 prevailing in the first pressure chamber and the pressure p2 prevailing in the second pressure chamber are dynamically controlled by means of a regulator controlled valve system. The regulator can be operated in two operating modes. In the first operating mode, the deflection of the chip gripper and/or a variable derived from it is controlled based on the signal delivered by a position encoder which measures the deflection of the chip gripper. In the second operating mode, the pressure p1 and/or the pressure p2 and/or the pressure differential p1-p2 is controlled.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.