Process of fabricating conductive column
US7284323B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Oct 11, 2004 |
| Grant date | Oct 23, 2007 |
| Priority date | — |
| Expiry date | Feb 4, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49167
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A fabrication process of a conductive column suitable for a fabrication of a circuit board. The circuit board comprises a dielectric layer. A first blind hole is formed in the dielectric layer from a second surface opposite to the first surface, wherein the blind end of the first blind hole connects to the blind end of the second blind hole. The first blind hole and the second blind hole constitute a through hole. The through hole is formed in an hourglass shape such that an inner diameter of the through hole near the first or the second surface is substantially larger than an inner diameter of the through hole near a middle portion of the through hole. A conductive material is filled in the though hole to form a conductive column.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.