Electronic package structures using land grid array interposers for module-to-board interconnection
US7284992B2 · kind B2 · utility
9Cited by
2References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 22, 2006 |
| Grant date | Oct 23, 2007 |
| Priority date | — |
| Expiry date | Mar 22, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/368
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Apparatus and methods are provided for constructing electronic package structures using LGA (land grid array) module-to-board connectors that are designed to provide higher count I/O interconnections by expanding LGA area, but without having to increase chip module footprint or reduce the pitch of area array I/O contacts of an LGA interposer or circuit board beyond practical limits.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.