Method of forming a solution processed device
US7285501B2 · kind B2 · utility
20Cited by
7References
29Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 17, 2004 |
| Grant date | Oct 23, 2007 |
| Priority date | — |
| Expiry date | Jul 27, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K85/111
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Embodiments of methods, apparatuses, devices, and/or systems for forming a solution processed device are described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.