Electronic parts packaging structure and method of manufacturing the same
US7285728B2 · kind B2 · utility
18Cited by
10References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 28, 2005 |
| Grant date | Oct 23, 2007 |
| Priority date | — |
| Expiry date | Mar 28, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49128
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic parts packaging structure of the present invention includes a core substrate having such a structure that a recess portion is provided by forming a prepreg insulating layer having an opening portion therein on a resin layer, and an electronic parts mounted on a bottom portion of the recess portion of the core substrate such that a connection pad of the electronic parts is directed upward, and also, such a structure may be employed that the electronic parts is embedded in a resin layer of a core substrate having a structure that the resin layer is formed on the prepreg insulating layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.