Process for producing microelectromechanical components and a housed microelectromechanical component

US7285834B2 · kind B2 · utility

Assignee

• Schott AG · DE

Inventors

• Jürgen Leib · Freising, DE
• Florian Bieck · Singapore, SG

Key dates

• Filing date: Mar 18, 2006
• Grant date: Oct 23, 2007
• Expiry date: Mar 18, 2026

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B81B2207/096
• WIPO field: Micro-structural and nano-technology
• WIPO sector: Chemistry

Abstract

A process produces microelectromechanical components from a substrate that has a first side and a second side which is substantially opposite from the first side, and at least the first side has at least one microelectromechanical element. The process includes the step of providing at least one conductive passage into the substrate, connecting the first side to the second side, and securing at least one support to the first side of the substrate, with the at least one electrically conductive passage uncovered by thinning the substrate material with the mechanical stability being ensured by the support.