Patent · US Expired

Probe card having deeply recessed trench and method for manufacturing the same

US7285967B2 · kind B2 · utility

2Cited by
5References
11Claims
0Family size

Assignee

Inventors

Key dates

Filing dateNov 18, 2005
Grant dateOct 23, 2007
Priority date
Expiry dateNov 18, 2025

Classification

  • Technology area (CPC G)Physics
  • CPC primaryG01R3/00
  • WIPO fieldMeasurement
  • WIPO sectorInstruments

Abstract

The present invention relates to a probe card that a probe of the probe card is movable only in a vertical direction using a trench to improve a electrical or a mechanical characteristic and to automatically limit the vertical movement thereof within a predetermined range. A pitch may be reduced so as to correspond to a decreasing distance between pads. A flatness of a probe tip may be maintained within a few micrometers using a semiconductor manufacturing process. 32 simultaneous parallel testing is possible contrary to a convention probe card. A wafer level testing is possible, and time and cost for a wafer testing are reduced.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.