Device and method for the harmonized positioning of wafer disks
US7287951B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jul 9, 2002 |
| Grant date | Oct 30, 2007 |
| Priority date | — |
| Expiry date | Jul 9, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S414/136
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A device for aligning a plurality of vertically arranged (upright) disks (20), especially wafer disks during the fabrication of semiconductor chips. Two mounting or bearing elements (30, 32) respectively have individually mounted guide rollers (34) positioned next to each other for each disk position. A drive device (40, 42; 50, 60; 240, 242) is for rotating the disks in relation to their azimuthal positions. A device (80) is provided for detecting the azimuthal positions of notches or indentations (22) arranged in the outer circumference in the disks (20). A device is provided for controlling the drive with the signals of the detection device (80) for detecting the azimuthal positions of the notches (22). The drive for rotating the disks in relation to their azimuthal positions has an individually driven drive roller element (42) for each disk (20) mounted on the stationary axis. In one embodiment, the drive roller elements, via a plurality of transmission rollers, can be selectively coupled to a driven roller (60) with the aid of the actuator elements. In a second embodiment, the first drive roller is individually driven by a plurality of individually controlled drive elements (2…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.