Process for treating substrates for the microelectronics industry, and substrates obtained by this process
US7288418B2 · kind B2 · utility
15Cited by
7References
20Claims
0Family size
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Key dates
| Filing date | Feb 7, 2006 |
| Grant date | Oct 30, 2007 |
| Priority date | — |
| Expiry date | Feb 20, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/974
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A process for treating substrates for the microelectronics or optoelectronics industry, wherein the substrates include on at least one of their faces a working layer in which components are intended to be formed. The process includes a step of annealing under a reductive atmosphere followed by a step of chemical-mechanical polishing on the free surface of the working layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.