Patent · US Expired

Method for producing a cover, method for producing a packaged device

US7288435B2 · kind B2 · utility

283Cited by

6References

13Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Robert Aigner · Winter Garden, US
Martin Franosch · Munich, DE
Andreas Meckes · Munich, DE
Klaus-Guenter Oppermann · Holzkirchen, DE
Marc Strasser · Munich, DE

Key dates

Filing date	Aug 18, 2004
Grant date	Oct 30, 2007
Priority date	—
Expiry date	Dec 31, 2025

Classification

Technology area (CPC H)Electricity
CPC primaryH03H9/105
WIPO fieldBasic communication processes
WIPO sectorElectrical engineering

Abstract

In a method for producing a cover for a region of a substrate, first a frame structure is produced in the region of the substrate, and then a cap structure is attached to the frame structure so that the region under the cap structure is covered. Thus, sensitive devices may be protected easily and at low cost from external influences and particularly from a casting material for casting the entire packaged device, which results when a diced chip is cast.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.