Stacked alignment mark and method for manufacturing thereof
US7288836B2 · kind B2 · utility
3Cited by
1References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 29, 2005 |
| Grant date | Oct 30, 2007 |
| Priority date | — |
| Expiry date | Sep 16, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A stacked alignment mark. The stacked alignment mark comprises a first alignment mark and a second alignment mark. The first alignment mark is located in a first film layer, wherein the first alignment mark is composed of a plurality of conductive wires. The second alignment mark is located in a second film layer under the first film layer. The first alignment mark is located in a first region corresponding to a second region in which the second alignment mark is located. Moreover, the second alignment mark at least contains a third region directly under a space between each two adjacent first conductive wires.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.