Polyurethane urea polishing pad
US7291063B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 19, 2006 |
| Grant date | Nov 6, 2007 |
| Priority date | — |
| Expiry date | Jul 19, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1057
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The present invention relates to an article for altering a surface of a workpiece, or a polishing pad having a window. In particular, the polishing pad includes a polyurethane urea material wherein the polyurethane urea material contains cells which are at least partially filled with gas. The polyurethane urea material can be prepared by combining polyisocyanate and/or polyurethane prepolymer, hydroxyl-containing material, amine-containing material and blowing agent. The polishing pad according to the present invention is useful for polishing articles, and is especially useful for chemical mechanical polishing or planarization of microelectronic and optical electronic devices such as but not limited to semiconductor wafers. The window of the polishing pad is at least partially transparent and thus, can be particularly useful with polishing or planarizing tools that are equipped with through-the-platen wafer metrology.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.