Barrier layer for a processing element and a method of forming the same
US7291566B2 · kind B2 · utility
14Cited by
118References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 18, 2004 |
| Grant date | Nov 6, 2007 |
| Priority date | — |
| Expiry date | Mar 18, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/32559
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
In order to mitigate erosion of exposed processing elements in a processing system by the process and any subsequent contamination of the substrate in the processing system, processing elements exposed to the process are coated with a protective barrier. The protective barrier comprises a protective layer that is resistant to erosion by the plasma, and a bonding layer that improves the adhesion of the protective layer to the processing element to mitigate possible process contamination by failure of the protective layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.