Signal transmission structure and circuit substrate thereof
US7291916B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 8, 2005 |
| Grant date | Nov 6, 2007 |
| Priority date | — |
| Expiry date | Aug 16, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09718
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A signal transmission structure suitable for a multi-layer circuit substrate comprising a core layer and at least a dielectric layer is provided. The signal transmission structure according to the present invention comprises a first via landing pad and a reference plane. The first via landing pad is disposed on a first surface of the core layer, and covering one end of the through hole of the core layer. The dielectric layer covers the first via landing pad and the first surface of the core layer. And the first reference plane is disposed above the dielectric layer, having a first opening disposed above one end of the through hole. Wherein, the area where the first reference plane is projected on the first surface of the core layer does not overlap with the area where the first via landing pad is projected on the first surface of the core layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.