Method of fabricating printed circuit board having embedded multi-layer passive devices
US7293356B2 · kind B2 · utility
86Cited by
7References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 3, 2006 |
| Grant date | Nov 13, 2007 |
| Priority date | — |
| Expiry date | Jun 12, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention relates to a method of fabricating a printed circuit board having embedded multi-layer passive devices, and particularly, to a method of fabricating a printed circuit board having an embedded multi-layer capacitor, in which a capacitor is formed to have multiple layers in the PCB to increase capacitance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.