Micromechanical cap structure and a corresponding production method

US7294894B2 · kind B2 · utility

Assignee

• Robert Bosch GmbH · DE

Inventors

• Frank Fischer · Mesa, US
• Peter Hein · Bamberg, DE
• Eckhard Graf · Gomaringen, DE

Key dates

• Filing date: Jul 4, 2002
• Grant date: Nov 13, 2007
• Expiry date: Jul 4, 2022

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B81C2203/031
• WIPO field: Micro-structural and nano-technology
• WIPO sector: Chemistry

Abstract

A micromechanical cap structure and a corresponding manufacturing method are described. The micromechanical cap structure includes a first wafer with a micromechanical functional structure, and a second wafer to form a cap over the micromechanical functional structure. The first and second wafers have in their interior a support structure with a metal-semiconductor contact, and in their edge zone a bonding structure. The edge zone of the second wafer, when in the capped state, is arched in relation to the interior of the second wafer.