Apparatus and methods for constructing antennas using wire bonds as radiating elements

US7295161B2 · kind B2 · utility

Assignee

• International Business Machines Corporation · US

Inventors

• Brian P. Gaucher · Brookfield, US
• Duixian Liu · Yorktown Heights, US
• Ullrich R. Pfeiffer · Wolfsburg, DE
• Thomas Zwick · Leutkirch im Allgäu, DE

Key dates

• Filing date: Aug 6, 2004
• Grant date: Nov 13, 2007
• Expiry date: Aug 6, 2024

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/3025
• WIPO field: Telecommunications
• WIPO sector: Electrical engineering

Abstract

Antennas are provided which are constructed using one or more wires as radiating elements attached to a substrate or chip, wherein wire bonding methods can be used to attach and form loop profiles for the wires. The antennas can be integrally packaged with IC chips (e.g., IC transceivers, receivers, transmitters, etc.) to build integrated wireless or RF (radio frequency) communications systems.