Inventor · Yorktown Heights, NY, US

Duixian Liu

97Patents
25h-index
61Co-inventors
91Inventor score

Filing activity: May 20, 1994 → Feb 10, 2021

Most-cited inventions

PatentTitleAreaCited byStatus
US7295161B2 Apparatus and methods for constructing antennas using wire bonds as radiating elements Electricity 202 Expired
US8917210B2 Package structures to improve on-chip antenna performance Electricity 184 Active
US8988299B2 Integrated antenna for RFIC package applications Electricity 141 Active
US7372408B2 Apparatus and methods for packaging integrated circuit chips with antenna modules providing closed electromagnetic environment for integrated antennas Electricity 139 Expired
US6339400B1 Integrated antenna for laptop applications Electricity 112 Expired
US7119745B2 Apparatus and method for constructing and packaging printed antenna devices Electricity 95 Expired
US6853336B2 Display device, computer terminal, and antenna Electricity 90 Expired
US9172132B2 Integrated antenna for RFIC package applications Electricity 67 Active
US5532703A Antenna coupler for portable cellular telephones Electricity 66 Expired
US6950069B2 Integrated tri-band antenna for laptop applications Electricity 65 Expired
US6141634A AC power line network simulator Emerging Cross-Sectional Technologies 65 Expired
US9620464B2 Wireless communications package with integrated antennas and air cavity Electricity 64 Active
US6686886B2 Integrated antenna for laptop applications Electricity 63 Expired
US7053844B2 Integrated multiband antennas for computing devices Electricity 63 Expired
US7271769B2 Antennas encapsulated within plastic display covers of computing devices Electricity 59 Expired
US8269671B2 Simple radio frequency integrated circuit (RFIC) packages with integrated antennas Electricity 41 Active
US9196951B2 Millimeter-wave radio frequency integrated circuit packages with integrated antennas Emerging Cross-Sectional Technologies 40 Active
US8411444B2 Thermal interface material application for integrated circuit cooling Emerging Cross-Sectional Technologies 37 Active
US7518221B2 Apparatus and methods for packaging integrated circuit chips with antennas formed from package lead wires Emerging Cross-Sectional Technologies 35 Active
US9806422B2 Antenna-in-package structures with broadside and end-fire radiations Electricity 31 Active
US8648454B2 Wafer-scale package structures with integrated antennas Electricity 29 Active
US7728774B2 Radio frequency (RF) integrated circuit (IC) packages having characteristics suitable for mass production Emerging Cross-Sectional Technologies 29 Active
US6025811A Closely coupled directional antenna Electricity 29 Expired
US10170838B2 Antenna-in-package structures with broadside and end-fire radiations Electricity 27 Active
US9537199B2 Package structure having an integrated waveguide configured to communicate between first and second integrated circuit chips Electricity 26 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.