Direct cooling pallet tray for temperature stability for deep ion mill etch process
US7296420B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 2, 2004 |
| Grant date | Nov 20, 2007 |
| Priority date | — |
| Expiry date | Aug 27, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67333
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Embodiments of the present invention are directed to a pallet assembly which facilitates direct cooling of the wafer carrier. In one embodiment, the pallet assembly comprises a frame which holds at least one carrier of a component. The pallet assembly further comprises a tray which is operable for being mechanically coupled with the frame. The tray comprises at least one discreet region which corresponds with the carrier when the tray is coupled with the frame. In embodiments of the present invention, the discreet region comprises at least one hole extending through the tray for permitting a coolant medium to dissipate heat from the carrier.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.