Methods and apparatus for particle reduction in MEMS devices
US7297573B2 · kind B2 · utility
1Cited by
9References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 16, 2005 |
| Grant date | Nov 20, 2007 |
| Priority date | — |
| Expiry date | Nov 16, 2025 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01P1/023
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method for assembling a micro-electromechanical system (MEMS) device that includes a micro-machine is described. The method comprises forming the micro-machine on a die, the die having a top surface and a bottom surface, providing a plurality of die bonding pedestals on a surface of a housing, and mounting at least one of the top surface of the die and components of the micro-machine to the die bonding pedestals such that a bottom surface of the die at least partially shields components of the micro-machine from loose gettering material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.