System semiconductor device and method of manufacturing the same
US7297575B2 · kind B2 · utility
2Cited by
7References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 12, 2005 |
| Grant date | Nov 20, 2007 |
| Priority date | — |
| Expiry date | Nov 18, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A system semiconductor device includes a system LSI cell portion and a global wiring layer. The system LSI cell portion has a plurality of functional blocks for realizing specific functions on a semiconductor chip. The global wiring layer has a wiring layer on a semiconductor substrate. The system LSI cell portion is laminated with the global wiring layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.