Method of segmenting a wafer
US7297610B2 · kind B2 · utility
3Cited by
2References
17Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 18, 2005 |
| Grant date | Nov 20, 2007 |
| Priority date | — |
| Expiry date | Jul 7, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/78
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
First, a device wafer having a substrate layer and a device layer is provided. Then, a first mask pattern is utilized to remove the device layer uncovered by the first mask pattern. Subsequently, a medium layer is formed on the surface of the device wafer, and the medium layer is then bonded to a carrier wafer. Thereafter, a second mask pattern is utilized to remove the substrate layer uncovered by the second mask pattern. Finally, the medium layer is separated from the carrier wafer, the substrate layer is bonded to an extendable film, and the medium layer is then removed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.