Image sensor package structure and image sensing module
US7297918B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 15, 2006 |
| Grant date | Nov 20, 2007 |
| Priority date | — |
| Expiry date | Aug 15, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16195
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An image sensor package structure and an image sensing module are proposed. A substrate, a frame and a light transparent layer are used to package an image sensing chip to form the image sensor package structure. The frame is mounted on the substrate and located around the image sensing chip. The top of the frame extends toward the image sensing chip and upwards to form a locking and placing portion with an L-shaped cross section. Bend positions of the locking and placing portion form a placement space formed to accommodate and position the light transparent layer. The structure is simple, the fabrication is easy, and the gluing and packaging operations can be facilitated. Moreover, when the image sensor package structure and a lens set are assembled into an image sensing module, a lens base with a smaller size can be used to shrink the package area.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.