Sigurd Microelectronics Corp.
7Patents
4Active
7Granted
36Portfolio score
Filing activity: Sep 14, 2005 → Feb 2, 2017 · 3 expiring within 5 years
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7323675B2 | Packaging structure of a light-sensing device with a spacer wall | Electricity | 6 | Expired |
| US7297918B1 | Image sensor package structure and image sensing module | Electricity | 6 | Active |
| US7405456B2 | Optical sensor chip package | Electricity | 5 | Active |
| US9831197B1 | Wafer-level package with metal shielding structure and the manufacturing method thereof | Electricity | 5 | Active |
| US7282788B2 | Image sensing chip package structure | Electricity | 4 | Expired |
| US7547571B2 | Packaging method of a light-sensing semiconductor device and packaging structure thereof | Electricity | 3 | Active |
| US7358482B2 | Packaging structure of a light-sensing element and fabrication method thereof | Electricity | 1 | Expired |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.